Transient Thermal Cooling of Electronics Systems using Functional Graded Fins: Hybrid Computational Analysis
نویسندگان
چکیده
Passive cooling of electronics systems requires the use fins and spines. Improved heat transfer enhancements in have been achieved through porosity, magnetic field, functionally graded materials, etc. However, space time-dependent analysis passive device with inherent nonlinearities explorations conditions at tip not fully presented. Therefore, this work presents an application hybrid computation using combined methods Laplace transformation Legendre wavelet collocation to nonlinear thermal models a longitudinal conductive-radiative extended surface. The spatial-dependent conductivity is considered for three different cases. present results demonstrated good agreement numerical results. significances model's pertinent parameters on fin’s performance are thoroughly scrutinized aid graphical illustrations. fin response decreases increase conductive-convective parameters, but it increases as time progresses. in-homogeneity index directly proportional FGM temperature. convective term inversely distribution. temperature under quadratic-law shows enhanced lower distribution than linear- exponential-law conductivity. Ultimately, study provides very useful design FGM.
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ژورنال
عنوان ژورنال: The Journal of Engineering and Exact Sciences
سال: 2023
ISSN: ['2527-1075']
DOI: https://doi.org/10.18540/jcecvl9iss4pp15810-01e